Product:

Specialize in DRAM products which can be widely used in PC peripheral, home appliances, and consumer, communications systems, with various density and interface specifications. Due to the growing adoption of System in Package (SiP) in many applications, ESMT has also developed Known-Good-Die (KGD) and Multi-Chip Package (MCP) solutions of memory products.

Cooperation: Consumer electronics and IoT deployment, ex. Huawei, ZTE, Toshiba, Witten and Seagate, Intel, Silicon Power, Edomtech, MCP

Certification: ISO 9001, ISO 14001, RoHS, Sony GP