Provide Leadframe base packages, including P-DIP, SOP, SOJ, SSOP, TSSOP, MSOP, QFP, LQFP, TQFP, PLCC, TO, etc. Also provide circuit probing and final test. Nowadays moving into Stacked Die Package, MCM and Copper Wire production.
Cooperation: IDMS
Certification: ISO 9001, IATF 16949, IECQ QC080000, ISO 14001, Sony GP
TSITE Exhibiting Record:
Taiwan smart vehicle ecosystem online show (2021-08-24 - 2045-12-31)