Automobiles & Motorcycles
Product:
A professional IC packaging supplier, who leveraged on core TinyBGA packaging technology to achieve good heat dissipation, low energy consumption, small area, high capacity and high efficiency memory packaging application. KingPak is also developing the FIR Sensor, ToF Sensor and other automobile related packaging technology.
Cooperation:ON Semiconductor, Omnivision, Sony, STMicro
Certification:IATF16949, ISO14001, ISO 9001